Automated Lamination Machine (Packaging Substrate)

Unique transportation and lamination technologies for industry's strict requirements with particle control, ESD control and Minimized potential scratches.
Product Features：
1. Fully enclosed body design, equipped with FFU high-efficiency filtration.
2. 3-point transmission, lifting-type centering.
3. High precision in lamination position with operational stability.
4. Post-lamination equipment with universal consumables.
5. PLC Network module, complying with industry SECS/GEM.
6. Suitable for high-end IC substrate lamination, including Glass CORE substrates.

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