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Description
1. Does not etch protective layers such as copper surface, gold surface, with excellent solder protection effect.
2. Dry film residue is fine and granular, greatly reducing the risk of "film entrapment". Especially suitable for fine circuit production (<3mil).
3. Fast stripping speed, 1.5 times that of traditional inorganic alkali, greatly improving productivity.
4. Suitable for HDI, special dry film and ultra-fine circuit stripping.
2. Dry film residue is fine and granular, greatly reducing the risk of "film entrapment". Especially suitable for fine circuit production (<3mil).
3. Fast stripping speed, 1.5 times that of traditional inorganic alkali, greatly improving productivity.
4. Suitable for HDI, special dry film and ultra-fine circuit stripping.
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