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Description
1. Stable etching rate, high roughness, Ra 0.2–0.6 μm, providing excellent adhesion between solder mask, dry/wet film and copper surface.
2. Easy production control and management.
3. Suitable for spray and immersion processes.
4. Good chloride resistance, ensuring stable microetching efficiency.
2. Easy production control and management.
3. Suitable for spray and immersion processes.
4. Good chloride resistance, ensuring stable microetching efficiency.
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