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Description
Unique transportation and lamination technologies for industry's strict requirements with particle control, ESD control and Minimized potential scratches.
Product Features：
1. Fully enclosed body design, equipped with FFU high-efficiency filtration.
2. 3-point transmission, lifting-type centering.
3. High precision in lamination position with operational stability.
4. Post-lamination equipment with universal consumables.
5. PLC Network module, complying with industry SECS/GEM.
6. Suitable for high-end IC substrate lamination, including Glass CORE substrates.
Product Features：
1. Fully enclosed body design, equipped with FFU high-efficiency filtration.
2. 3-point transmission, lifting-type centering.
3. High precision in lamination position with operational stability.
4. Post-lamination equipment with universal consumables.
5. PLC Network module, complying with industry SECS/GEM.
6. Suitable for high-end IC substrate lamination, including Glass CORE substrates.
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