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Description
It is mainly used in process protection and load-bearing.
It has adhesion at room temperature, which can effectively fix the product during cutting, so that it does not displace, does not drop the material, and can be easily peeled off after heating.
It can be made on both one and two sides.
Pyrolysis temperature: 80°C, 90°C, 120°C, 150°C, 180°C.
Application: Wafer grinding process, wafer dicing process, ceramic chip MLCC dicing process, LED dicing, lens lens dicing, substrate dicing, nameplate dicing or other wafer die dicing in the semiconductor industry.
It has adhesion at room temperature, which can effectively fix the product during cutting, so that it does not displace, does not drop the material, and can be easily peeled off after heating.
It can be made on both one and two sides.
Pyrolysis temperature: 80°C, 90°C, 120°C, 150°C, 180°C.
Application: Wafer grinding process, wafer dicing process, ceramic chip MLCC dicing process, LED dicing, lens lens dicing, substrate dicing, nameplate dicing or other wafer die dicing in the semiconductor industry.
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